Facilities


Chemical Mechanical Polishishing (CMP) Tool:

Chemical Mechanical Polishing (CMP) is a process that is used for the planarization of semiconductor wafers. This process combines mechanical and chemical polishing in order to produce a clean, flat surface. CMP is a key component in semiconductor industry for fabricating smaller integrated circuits.

 CMP Tool


Atomic Layer Deposition (ALD) System:
 

Atomic Layer Deposition is an advanced deposition technique which allows for depositing ultra-thin films with great quality, precision and uniformity.
Soon, our ALD research system will arrive in our lab. Here is the picture of the system undergoing testing at the vendor.

ALD System