|
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Ohmic contact to InP laser
Au/Sn solder for optoelectronic packaging
|
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Douglas G. Ivey: Projects, Co-workers
and Facilities
Current Projects
|
Project
|
Support
|
|
Electroplating of Alloy Films
|
NSERC/AESF
|
|
Metallization Issues in Microelectronic Device Packaging
|
Micralyne/NSERC
|
|
Electron Microscopy Characterization of Fuel Cell
Materials
|
COURSE/Global Thermoelectric
|
|
III-V Semiconductor Corrosion
|
NSERC
|
|
Microstructural Engineering of Higher Strength
Microalloyed Steels
|
NSERC/IPSCO
|
Students and Co-workers
|
Name
|
Position
|
|
Anqiang He
|
PDF
|
|
Yin Huang
|
PhD Student
|
|
Kioumars Poorhaydari
|
PhD Student
|
|
Barbara Djurfors
|
PhD Student
|
|
Yahui Zhang
|
PhD Student
|
|
Heather Welling-Gauld
|
PhD Student
|
|
Ade Adeleke
|
PhD Student
|
|
David Waldbillig
|
MSc Student
|
|
Kristian Olsen
|
MSc Student
|
|
William Qu
|
MSc Student
|
Research Facilities
- JEOL 2010 TEM equipped
with EELS and UTW EDX
- Philips 420 TEM
- Hitachi H-2700 SEM
equipped with UTW EDX
- Rigaku Rotating Anode
XRD System
- Gatan Duomill with
Liquid Nitrogen Cooling
- Gatan and Southbay
Dimplers and Ultrasonic Disc Cutter
- Chemical/Electrochemical
Polishers
- Optical Metallography
Facilities
- Electroplating and
Electrochemical Measurement Equipment
- Alberta Centre for
Surface Engineering and Science (ACSES) – under development – completed
facility will include XPS, ToF SIMS, FE-SAM, HREELS and LEED
|
