Chemical and Materials Engineering

AuSn/Au₅Sn multilayers

Corrosion product on GaAs

CBED pattern from Ni2InP

Electroplated Au/Sn Solder

Douglas Ivey, Ph.D. (Windsor), P.Eng
Professor (Materials)

Rm 634 Chemical-Materials Engineering Building
(780) 492-2957
Fax: (780) 492-2881
doug.ivey@ualberta.ca

Updated August 19, 2003

Research Areas: Electron Microscopy (TEM and SEM), Materials Characterization, Metal/Semiconductor Interfaces, Thin Film Deposition

Douglas Ivey has more than fifteen years research experience in such diverse areas as the development of hydrogen storage materials, ferrous alloys, fuel cell materials, design and characterization of semiconductor metallizations (both compound and elemental semiconductors), microelectronic packaging and the characterization of cementitious materials used for containment of heavy metal waste. He has expertise in several microstructural characterization techniques, including transmission and scanning electron microscopy (TEM and SEM) and x-ray diffraction (XRD).

Douglas Ivey has published over 100 refereed technical papers and made numerous presentations at conferences.

Sample Publications:

J. Huezo, L. Jian and D.G. Ivey, 2003, Carburisation of Interconnect Materials in Solid Oxide Fuel Cells, Journal of Power Sources, Vol. 123, 151-162

A. He, B. Djurfors, S. Akhlaghi and D.G. Ivey, 2002, Pulse Plating of Gold-Tin Alloys for Microelectronic and Optoelectronic Applications, Plating and Surface Finishing, Vol. 89, 48.

B. Djurfors and D.G. Ivey, 2002, Microstructural Characterization of Pulsed Electrodeposited Au/Sn Alloy Thin Films, Materials Science and Engineering B, Vol. 90, 309-320.

S. Akhlaghi and D.G. Ivey, 2002, Precipitation Behaviour of Grade 100 Structural Steel, Canadian Metallurgical Quarterly, Vol. 41, 111-119.

G.S. Weng, J.L. Luo, D.G. Ivey, 2002, Galvanic Corrosion of III-V Semiconductors, Journal of Vacuum Science and Technology A, Vol. 20(3), 1015-1022.

J. Doesburg and D.G. Ivey, 2001, Codeposition of Gold-Tin Alloys from a Non-Cyanide Solution, Plating and Surface Finishing, Vol. 88, 78-83.

B. Djurfors and D.G. Ivey, 2001, Pulsed Electrodeposition of the Eutectic Au/Sn Solder for Optoelectronic Packaging, Journal of Electronic Materials, Vol. 30, 1249-1254.

C.A. Steer, G.S. Weng, J.L. Luo and D.G. Ivey, 2000, Formation of As2O3 During Anodic Dissolution of GaAs, Electrochemistry Communications, Vol. 2, 754-761.

Eric Z. Tang, Thomas H. Etsell and Douglas G. Ivey, 2000, A New Vapor Deposition Method to Form Composite Anodes for Solid Oxide Fuel Cells, Journal of the American Ceramic Society, Vol. 83, 1626-1632.

D.G. Ivey, 1999, Platinum Metals Utilized in Ohmic Contacts to III-V Semiconductors, Platinum Metals Review, (invited review), Vol. 43, 1-12.

W. Sun and D.G. Ivey, 1999, Development of an Electroplating Solution for Codepositing Au-Sn Alloys, Materials Science and Engineering B, Vol. B65, 111-122.

Y.G. Wang, D. Wang and D.G. Ivey, 1998, Thermal Stability of Pd/Ge-based Ohmic Contacts to n-type GaAs, Journal of Applied Physics, Vol. 84, 1310-1315.

R.B. Heimann, H. Kurzweg, D.G. Ivey and M.L. Wayman, 1998, Microstructural and In Vitro Chemical Investigations into Plasma-Sprayed Bioceramic Coatings, Journal of Biomedical Materials Research, Vol. 43, 441-450.

D.G. Ivey, J. Luo, S. Ingrey, R. Moore and I. Woods, 1998, Galvanic Corrosion Effects in InP-based Laser Ridge Structures, Journal of Electronic Materials,Vol. 27, 89-95.

O. Omotoso, D.G. Ivey and R. Mikula, 1998, Hexavalent Chromium In Tricalcium Silicate, Part I: Quantitative X-ray Diffraction Analysis of Crystalline Hydration Products, Journal of Materials Science, Vol. 33, 507-513.

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