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As communication systems advance and lower frequency bands become congested, the operation frequency is expanding from radio frequency to higher frequency bands such as millimeter-waves. At the same, multifunctionality and reconfigurability is becoming an inherent part of mobile systems. To satisfy these demands, our group employs micro/nano technology to create tunable and miniaturized microwave and millimeter-wave devices and systems for transceiver front ends.
The next generation of communication technology is quickly approaching. Millimeter-waves, the 30 to 300 GHz spectrum residing above standard communication frequencies, are increasingly drawing the attention of industry for application in the future fifth generation, or 5G, cellular technology. These higher frequency waves offer many benefits including a largely under-utilized spectrum, as well as increased bandwidths. The engineering challenges presented by millimeter-waves are being addressed head on by our research group, where we focus on the design of planar, integrated, low loss and tunable millimeter-wave devices and components.
By combining the benefits of planar technology with high performance waveguide structures, a millimeter-wave design platform has been developed. Using standard CMOS microfabrication techniques and thick positive photoresist sacrificial layers, our research group have fabricated and tested fully monolithic 3D waveguide structures. Research into further miniaturization of these structures is presently underway, allowing miniaturizations up to 80% or greater, while maintaining high quality performance. Such structures offer the potential of complete integration of RF front end systems on the chip, from the antenna all the way to the analogue-to-digital converter.
Due to 5G network architecture calling for complex modulation schemes and extensive added functionality, a level of tunability and reconfigurability unmatched in present RF communication technology will be essential. RF MEMS have shown promising characteristics including low insertion loss and high performance at millimeter-wave frequencies, and thus will be key components in the design of tunable and reconfigurable RF front end systems for 5G. Our research group explores the possibilities of RF MEMS integration into high performance systems, at both the wafer-level and for printed circuit board, or PCB, technologies.
Research on satellite communications and wireless devices is limited and sets forth new challenges. Current planar technology should be optimized for performance. High performance technology such as rectangular waveguides are typically bulky and difficult to integrate. Our research group aims to explore new integrated structures and technologies for further miniaturization while maintaining high quality performance. Miniaturized substrate integrated waveguides (SIW) based on full, half, and quarter-mode structures are utilized to design filters and couplers.
