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Substrate Bonding Using Microwave Susceptors

This project demonstrated the use of a novel efficient metallic susceptor for generating controllable and rapid localized heating for low-cost substrate bonding using commercial microwave ovens. The microwave oven were modeled and enhanced microwave susceptors were designed based on electromagnetic simulations. The designed susceptors were then fabricated using a novel low cost prototyping technique for metal electrode patterning. Proposed prototyping technique utilizes a commercial CO2 laser cuter for metal patterning.It was demonstrated that by use of proposed susceptors, a PMMA substrate can be heated up rapidly to its melting point. The designed susceptors were then applied to PMMA microfluidics bonding producing a uniform bond.